Odisha Signs $3.3 Billion MoU with Intel, 3DGS to Set Up Advanced Semiconductor Substrate Facility

Speaking on the occasion, Union Minister Ashwini Vaishnaw said that the MoU aligns with the government’s vision to develop the entire semiconductor manufacturing ecosystem. He noted that entry of global firms like Applied Materials, Lam Research, Tokyo Electron, Merck Electronics, and ASML reflects industry trust in India.

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